Polyimide Resin PI-200

Polyimide Resin PI-200

1. Introduction

Polyimide resin PI-BT is an advanced composite matrix resin, widely used in the manufacturing field of high performance composite materials, especially suitable for high temperature resistance high frequency high speed copper clad plate, sealing loading plate, high temperature resistance laminate and other manufacturing. The product can be diluted with acetone and other organic solvents, with high glass transition temperature and thermal stability. Very low dielectric loss; Excellent solvent resistance; Low coefficient of thermal expansion (CTE, T-axis); High copper foil peeling strength; Good storage stability and other advantages.